copper-coated film
Copper-clad film is a conductive composite film made by depositing a high-purity copper layer onto substrates such as PET, PP, or PI films using vacuum magnetron sputtering or electroless plating. It offers excellent conductivity, electromagnetic shielding, and thermal conductivity, with uniform surface quality, strong adhesion, and bend resistance. The film can be laminated, coated, slitted, or die-cut, making it suitable for applications in electronic shielding, new energy, and thermal management.
Material
PET/PP/PI substrate with vacuum-deposited high-purity copper layer
Tolerance
Thickness tolerance: ±0.005mm; Width tolerance: ±0.5mm
Surface Treatment
Single-sided copper-plated, Double-sided copper-plated, Anti-oxidation treatment, Adhesive backing coating
Application Areas
Electromagnetic shielding materials, new energy batteries, thermal conductive materials, electronic component shielding, and cable sheathing.
Product Features
- Excellent conductivity and effective electromagnetic shielding
- Uniform copper layer with strong adhesion
- Flexible and durable; resists peeling
- Suitable for compound machining; excellent machinability